Precision electronics is intolerant to particulate: PM2.5 and even PM1 can bridge tracks, scratch optics, and seed defects. A clean build depends on source capture, stable airflow, and surface discipline.

Capture at source

• Provide LEV at soldering, fluxing, conformal coating, and abrasive cleaning stations. Capture should be close to the workface with hoods that do not obstruct operators.
• For powder or resin handling in potting and 3D printing, enclose decanting and keep drop heights minimal.
• Switch to low-shedding wipes and packaging; avoid cardboard in clean zones where feasible.

Control air quality

Use recirculating air units with high-efficiency HEPA (H14) or, where required, ULPA filtration to remove fine particulate. Maintain pressure cascades from clean to support areas and ensure air change rates are met under load. Avoid turbulence from poorly placed fans that short-circuit laminar flow over benches.

Surface discipline

• Ban sweeping and compressed air. Use approved industrial vacuums with antistatic tooling for floors, benches, and machine enclosures.
• Adopt tack mats at entries and change frequently. Remove fibre-shedding garments from assembly areas.
• Schedule micro-cleaning of keyboards, touchscreens, and optics to prevent localised contamination.

Monitoring and response

Trend PM1/PM2.5 with suitable meters and set alert thresholds tied to process hold points. Investigate spikes by checking hood placement, filter loading, and door discipline. Keep spare filters and gaskets; minor bypass can undo high filter efficiency.

Practical takeaways

• LEV at all emission points; keep hoods close and unobtrusive.
• Use H14 or ULPA filtration and validate airflow under load.
• Vacuum-only housekeeping; avoid fibres and shedding sources.
• Maintain pressure cascades and disciplined entry procedures.
• Trend PM1/PM2.5 and act on deviations immediately.

Consistent attention to these controls reduces defects, stabilises yield, and keeps sensitive assemblies within specification.